Product Catalog
From precision hard-and-brittle material cutting to stone and engineering applications, SHIYI provides two core cutting platforms — precision diamond wire saws and high-performance diamond wire ropes.
Precision Cutting Platform
Electroplated diamond wire technology for photovoltaic silicon wafers, semiconductor wafers, sapphire, optical glass and magnetic materials.
Heavy-Duty Cutting Platform
Laser-welded diamond bead technology for stone quarrying, slab processing, shaped cutting and reinforced concrete demolition.
Technical Enquiry
Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.
Sample fees can be credited toward bulk orders meeting the standard MOQ. Our technical team will respond within 24 hours. About our technical service
